Substrate preparation

1. Before installation make sure that windows and doors have been fitted and that the building is weathertight.
2. Should be used at temperatures between 10^oC – 30^oC and relative humidity 40% – 50%. Do not use at temperatures below 10^oC.
3. The moisture content of the screed must be in accordance to the relevant standards.
4. Wood humidity should be the one prescribed (8%-12%)
5. All surfaces must be dry and clean from dust and grease.

Application

1. Apply even quantity of the adhesive directly from the nozzle on only one of the seams to be bonded.
2. Place the next stripe in place whilst the adhesive is still wet (15-20 minutes) and apply pressure.
3. Excess adhesive should be removed immediately with a wet cloth.
4. Do not step on the newly bonded surface because the stripes may move from their position while the adhesive is still fresh.
5. Next day the floor can be used for light traffic. It is recommended the passage of 48 hours in order to allow a complete setting of the adhesive.