Surface preparation

Careful surface preparation is very important for optimum finish and durability.

1. The substrate should be dry and free from dust, chalk, grease and any foreign material that may harmfully affect adhesion.
2. Old, loose coatings, dirt, fats, oils, organic substances and dust need to be removed by mechanical means such as a sanding machine or where possible with high pressure washing machine. Possible dust after sanding must be removed.
3. Light sanding of wood parquet is necessary. Carefully remove dust. Internal moisture of wood must not exceed 12%-14%.
4. New concrete floors need to dry for at least 28 days. Moisture must not exceed 5% and ambient humidity not over 70%.
5. All substrates must be completely dry prior to application and rain must be avoided for 48 hours.
6. Minimum application temperature 10^oC.

Priming

Unsound surfaces can be primed with same material diluted 15-20 % with solvent DIL X – 100 for substrate strengthening.

Application

1. Mix carefully the 2 components taking care to ensure thorough mixing on the walls and the bottom of the pail.
2. Allow mixture to stand for 10-15 minutes.
3. Apply the first coat with a roller, brush or spray gun.
4. You must avoid to apply the varnish in heavily Äì thick coats, since it will wear rapidly.
5. The second coat may be applied when the first is thoroughly dry (6-24 hours depending on ambient temperature).
6. For maximum durability apply a third coat.
7. The final curing is achieved in 14 days (25^oC).

Maintenance of surface: wash with a mild detergent and water, and rinse thoroughly.

LEAD STATEMENT

WARNING: Treatment of old surfaces such as dry sanding, flame cutting and/or welding of the dry paint film will give rise to dust and/or hazardous fumes. Lead dust may be released. Lead is toxic. Exposure to lead dust can cause serious illness. Wet sanding/flatting should be used wherever possible. If exposure cannot be avoided by the provision of local exhaust ventilation, suitable respiratory protective equipment should be used.